论文信息 - Design and Electrical Characterization of Wafer-level Micro-package for GaAs-based RFMEMS Switches

Design and Electrical Characterization of Wafer-level Micro-package for GaAs-based RFMEMS Switches

Abstract Packaging of Micro-Electro-Mechanical system (MEMS) at wafer-level is one of the critical areas for its application, as the MEMS elements are delicate and can easily get damaged during wafer scribing or packaging process. We describe here a novel approach for wafer-level encapsulation of GaAs-based RFMEMS switches. EM simulation of the proposed microcaps has been carried out to study the effect of encapsulation on the switch performance. Both GaAs and Pyrex glass-based caps have been fabricated and the switches were encapsulated. The performance of the packaged switches has been characterized and the measured results show a close agreement with EM simulation.

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