Advanced heterogeneous integration technology trend for cloud and edge

Advanced heterogeneous integration (HI) technology is much needed for applications from edge to cloud to meet the stringent system-level requirements on performance, power, profile, cycle-time and cost (P3C2). In addition to 3DIC with TSV innovative packaging technologies such as silicon interposer (2.5D) and fan-out wafer-level-packaging (2D/3D) become new paradigm for the semiconductor industry to realize the system integration. In this paper, we will discuss the new trend of advanced packaging technology — a strong need for application-specific integration solutions. Many of those are proposed. The solution with higher performance at lower cost will prevail. Furthermore, the solutions that readily integrate multi-chip to enable chip-partition to extend Moore's Law effectively have long-term advantages.