SOI FinFET nFET-to-pFET Tracking Variability Compact Modeling and Impact on Latch Timing
暂无分享,去创建一个
Jim Johnson | Ning Lu | Jie Deng | Kai Zhao | Rainer Thoma | Richard Q. Williams | Ximeng Guan | Eric A. Foreman | Hasan M. Nayfeh | Henry Trombley | Noah Zamdmer | Ardasheir Rahman | Peter W. Schneider | Russ Robison | Steve Shuma | Brian Worth | James E. Sundquist | Scott K. Springer | Rick Wachnik
[1] Duane S. Boning,et al. DOE/Opt: a system for design of experiments, response surface modeling, and optimization using process and device simulation , 1994 .
[2] Natesan Venkateswaran,et al. First-Order Incremental Block-Based Statistical Timing Analysis , 2006, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[3] Ning Lu,et al. Modeling of Distance-Dependent Mismatch and Across-Chip Variations in Semiconductor Devices , 2014, IEEE Transactions on Electron Devices.
[4] B. Cheng,et al. Simulation based transistor-SRAM co-design in the presence of statistical variability and reliability , 2013, 2013 IEEE International Electron Devices Meeting.
[5] E.J. Nowak,et al. The effective drive current in CMOS inverters , 2002, Digest. International Electron Devices Meeting,.
[6] K.J. Kuhn,et al. Reducing Variation in Advanced Logic Technologies: Approaches to Process and Design for Manufacturability of Nanoscale CMOS , 2007, 2007 IEEE International Electron Devices Meeting.
[7] E.J. Nowak,et al. Modeling of Variation in Submicrometer CMOS ULSI Technologies , 2006, IEEE Transactions on Electron Devices.
[8] Colin C. McAndrew,et al. Device Correlation: Modeling using Uncorrelated Parameters, Characterization Using Ratios and Differences , 2006 .
[9] David Blaauw,et al. Statistical timing analysis for intra-die process variations with spatial correlations , 2003, ICCAD-2003. International Conference on Computer Aided Design (IEEE Cat. No.03CH37486).
[10] H. Kimura,et al. RTA-Driven Intra-Die Variations in Stage Delay, and Parametric Sensitivities for 65nm Technology , 2006, 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers..
[11] Tsu-Jae King Liu,et al. Gate Line Edge Roughness Model for Estimation of FinFET Performance Variability , 2009, IEEE Transactions on Electron Devices.
[12] S. Narasimha,et al. High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography , 2006, 2006 International Electron Devices Meeting.
[13] M. Belyansky,et al. High performance 32nm SOI CMOS with high-k/metal gate and 0.149µm2 SRAM and ultra low-k back end with eleven levels of copper , 2006, 2009 Symposium on VLSI Technology.
[14] M. D. Giles,et al. Process Technology Variation , 2011, IEEE Transactions on Electron Devices.
[15] Tsuchiya Osamu,et al. Global Identification of Variability Factors and Its Application to the Statistical Worst-Case Model Generation , 2006 .
[16] Phil Oldiges,et al. Non-planar device architecture for 15nm node: FinFET or trigate? , 2010, 2010 IEEE International SOI Conference (SOI).
[17] Kelin J. Kuhn,et al. CMOS transistor scaling past 32nm and implications on variation , 2010, 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
[18] S. Narasimha,et al. 22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL , 2012, 2012 International Electron Devices Meeting.
[19] B. Cheng,et al. Unified compact modelling strategies for process and statistical variability in 14-nm node DG FinFETs , 2013, 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).
[20] A.P. Chandrakasan,et al. Static noise margin variation for sub-threshold SRAM in 65-nm CMOS , 2006, IEEE Journal of Solid-State Circuits.
[21] G. Northrop,et al. High performance 14nm SOI FinFET CMOS technology with 0.0174µm2 embedded DRAM and 15 levels of Cu metallization , 2014, 2014 IEEE International Electron Devices Meeting.
[22] Andrew R. Brown,et al. Interplay Between Process-Induced and Statistical Variability in 14-nm CMOS Technology Double-Gate SOI FinFETs , 2013, IEEE Transactions on Electron Devices.
[23] Ning Lu,et al. Modeling FET Variation Within a Chip as a Function of Circuit Design and Layout Choices , 2005 .
[24] Andrew R. Brown,et al. Accurate simulations of the interplay between process and statistical variability for nanoscale FinFET-based SRAM cell stability , 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).
[25] K. Endo,et al. Comprehensive analysis of variability sources of FinFET characteristics , 2006, 2009 Symposium on VLSI Technology.
[26] M.J.M. Pelgrom,et al. Matching properties of MOS transistors , 1989 .
[27] J. Bokor,et al. Sensitivity of double-gate and FinFETDevices to process variations , 2003 .
[28] Wim Schoenmaker,et al. Statistical Modeling based on extensive TCAD simulations Proposed methodology for extraction of Fast/Slow models and Statistical models , 1998 .
[29] H. Komatsubara,et al. Impact of nMOS/pMOS gate length correlation on the accuracy of statistical modeling , 2001, 2001 6th International Workshop on Statistical Methodology (Cat. No.01TH8550).
[30] C. C. McAndrew,et al. Understanding MOSFET mismatch for analog design , 2003 .
[31] T. B. Hook,et al. Comprehensive study of effective current variability and MOSFET parameter correlations in 14nm multi-fin SOI FINFETs , 2013, 2013 IEEE International Electron Devices Meeting.
[32] Xin Li,et al. Extensions to Backward Propagation of Variance for Statistical Modeling , 2010, IEEE Design & Test of Computers.
[33] Asen Asenov,et al. A general approach for multivariate statistical MOSFET compact modeling preserving correlations , 2011, 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC).
[34] Kurt Keutzer,et al. Impact of spatial intrachip gate length variability on theperformance of high-speed digital circuits , 2002, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[35] K. J. Kuhn,et al. Considerations for Ultimate CMOS Scaling , 2012, IEEE Transactions on Electron Devices.
[36] Doris Schmitt-Landsiedel,et al. The impact of intra-die device parameter variations on path delays and on the design for yield of low voltage digital circuits , 1996, ISLPED '96.
[37] Changhwan Shin,et al. Study of Random-Dopant-Fluctuation (RDF) Effects for the Trigate Bulk MOSFET , 2009, IEEE Transactions on Electron Devices.