Recent advances of nanolead-free solder material for low processing temperature interconnect applications

Abstract Recent advances of nanolead-free solder materials for microelectronic packaging is presented. The syntheses of Sn, SnAg and SnAgCu nanoparticles and their size dependent melting temperature are discussed. Capping nanoparticle surfaces with organic molecules for antioxidation and particle size control is studied as well. An in-house made nanosolder pastes is formulated and its metallurgical joint onto a Cu substrate is demonstrated.

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