Helmet: A resistance drift resilient architecture for multi-level cell phase change memory system

Phase change memory (PCM) is emerging as a promising solution for future memory systems and disk caches. As a type of resistive memory, PCM relies on the electrical resistance of Ge2Sb2Te5 (GST) to represent stored information. With the adoption of multi-level programming PCM devices, unwanted resistance drift is becoming an increasing reliability concern in future high-density, multi-level cell PCM systems. To address this issue without incurring a significant storage and performance overhead in ECC, conventional design employs a conservative approach, which increases the resistance margin between two adjacent states to combat resistance drift. In this paper, we show that the wider margin adversely impacts the low-power benefit of PCM by incurring up to 2.3X power overhead and causes up to 100X lifetime reduction, thereby exacerbating the wear-out issue. To tolerate resistance drift, we proposed Helmet, a multi-level cell phase change memory architecture that can cost-effectively reduce the readout error rate due to drift. Therefore, we can relax the requirement on margin size, while preserving the readout reliability of the conservative approach, and consequently minimize the power and endurance overhead due to drift. Simulation results show that our techniques are able to decrease the error rate by an average of 87%. Alternatively, for satisfying the same reliability target, our schemes can achieve 28% power savings and a 15X endurance enhancement due to the reduced margin size when compared to the conservative approach.

[1]  Vijayalakshmi Srinivasan,et al.  Scalable high performance main memory system using phase-change memory technology , 2009, ISCA '09.

[2]  J. F. Webb,et al.  One-dimensional heat conduction model for an electrical phase change random access memory device with an 8F2 memory cell (F=0.15 μm) , 2003 .

[3]  Matt T. Yourst PTLsim: A Cycle Accurate Full System x86-64 Microarchitectural Simulator , 2007, 2007 IEEE International Symposium on Performance Analysis of Systems & Software.

[4]  Moinuddin K. Qureshi,et al.  Morphable memory system: a robust architecture for exploiting multi-level phase change memories , 2010, ISCA.

[5]  Andrea L. Lacaita,et al.  Unified mechanisms for structural relaxation and crystallization in phase-change memory devices , 2009 .

[6]  Margaret Martonosi,et al.  Wattch: a framework for architectural-level power analysis and optimizations , 2000, Proceedings of 27th International Symposium on Computer Architecture (IEEE Cat. No.RS00201).

[7]  Tao Li,et al.  Characterizing and mitigating the impact of process variations on phase change based memory systems , 2009, 2009 42nd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO).

[8]  Onur Mutlu,et al.  Architecting phase change memory as a scalable dram alternative , 2009, ISCA '09.

[9]  Tao Li,et al.  Exploring Phase Change Memory and 3D Die-Stacking for Power/Thermal Friendly, Fast and Durable Memory Architectures , 2009, 2009 18th International Conference on Parallel Architectures and Compilation Techniques.

[10]  Jun Yang,et al.  A durable and energy efficient main memory using phase change memory technology , 2009, ISCA '09.

[11]  Hyunjin Lee,et al.  Flip-N-Write: A simple deterministic technique to improve PRAM write performance, energy and endurance , 2009, 2009 42nd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO).

[12]  Vijayalakshmi Srinivasan,et al.  Enhancing lifetime and security of PCM-based Main Memory with Start-Gap Wear Leveling , 2009, 2009 42nd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO).

[13]  Y.C. Chen,et al.  Write Strategies for 2 and 4-bit Multi-Level Phase-Change Memory , 2007, 2007 IEEE International Electron Devices Meeting.

[14]  K QureshiMoinuddin,et al.  Scalable high performance main memory system using phase-change memory technology , 2009 .

[15]  Aamer Jaleel,et al.  DRAMsim: a memory system simulator , 2005, CARN.

[16]  Y.J. Song,et al.  Two-bit cell operation in diode-switch phase change memory cells with 90nm technology , 2008, 2008 Symposium on VLSI Technology.

[17]  D. Ielmini,et al.  Physical interpretation, modeling and impact on phase change memory (PCM) reliability of resistance drift due to chalcogenide structural relaxation , 2007, 2007 IEEE International Electron Devices Meeting.

[18]  A. Pirovano,et al.  Numerical Implementation of Low Field Resistance Drift for Phase Change Memory Simulations , 2008, 2008 Joint Non-Volatile Semiconductor Memory Workshop and International Conference on Memory Technology and Design.

[19]  Kinarn Kim,et al.  Reliability investigations for manufacturable high density PRAM , 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

[20]  Pad Frame,et al.  Impact resistance , 2004 .

[21]  Rajendran Panda,et al.  Statistical timing analysis using bounds and selective enumeration , 2002, TAU '02.

[22]  Guido Torelli,et al.  A Bipolar-Selected Phase Change Memory Featuring Multi-Level Cell Storage , 2009, IEEE Journal of Solid-State Circuits.

[23]  Moinuddin K. Qureshi,et al.  Improving read performance of Phase Change Memories via Write Cancellation and Write Pausing , 2010, HPCA - 16 2010 The Sixteenth International Symposium on High-Performance Computer Architecture.

[24]  Ferdinando Bedeschi,et al.  A Multi-Level-Cell Bipolar-Selected Phase-Change Memory , 2008, 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.

[25]  Christopher Frost,et al.  Better I/O through byte-addressable, persistent memory , 2009, SOSP '09.

[26]  Chung Lam Cell Design Considerations for Phase Change Memory as a Universal Memory , 2008, 2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).

[27]  Kevin Skadron,et al.  Temperature-aware microarchitecture , 2003, ISCA '03.