论文信息 - A Study on the Properties of Different IMP Ta, Ta(N) and Multi-Layer Ta/Ta(N) as Diffusion Barriers for Cu Metallization - 字舞流文

A Study on the Properties of Different IMP Ta, Ta(N) and Multi-Layer Ta/Ta(N) as Diffusion Barriers for Cu Metallization

L. He | C. Li | J. Xie | Jun Jie Wu | Y. Qian | Z. Zeng | Yaohui Zhang | H. Liu | L. He | J. Wu