Fabrication of microcomponents using adhesive bonding techniques

Integrating complex microcomponents, let alone microsystems, as monoliths often is not feasible. Microcomponents with parts made of different materials or by different processes can be assembled, however. In this way, closed chambers can be made which contain the movable parts. Assembly and interconnection techniques thus play a significant role in microsystems technology and have major impacts on the quality, reliability, and economic viability of microsystems. Adhesive bonding techniques have been developed and successfully applied in making complex microcomponents on a laboratory scale as well as in a small series production of micropumps. These bonding techniques will be described in this paper, and the great potential of adhesive bonding as a microassembly technique in microsystems technology will be demonstrated by three examples.

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