Extraction of material parameters for creep experiments on real solder-joints by FE analysis

A modern approach to determine material data of solder alloys such as SnAg and SnAgCu is to measure the mechanical behaviour direct on a CSP/BGA solder connection. Advantages of that technique of measurement on industrial manufactured solder bumps are the considerations of miniaturized volumes and the material diffusion from connection pad into the alloy during reflow soldering process. Compared to the tensile test the shear experiment differs in the way of initiation the force load into the solder alloy. The shear force load inducts a multiaxial state of stress. This is the reason for the confrontation with a higher effort into the conversion procedure to determine specific coefficients for the material law. In several publications creep data were published based on shear force load measurements and applied cylinder model to convert primary data into equivalent values. In practice, the specimen bumps may have been different in their shape, depending on pad geometry, solder volume and weight of electronic component. How does the shape of solder joints influence the creep behaviour? A form parameter has been introduced to be able to describe a wide range of solder bump shapes. Every bump shape from barrel to hyperbolic can now be regarded. The form parameter also takes place in the conversion of experimental data into equivalent data. The determined creep material laws, based on the improved analytic model, describe the deformation behaviour of solder joints more accurately, than the commonly assigned creep laws using the pure cylinder model. The shape effect is shown on a FEM analysis of the experimental setup of creep measurements on shape varied Sn96.5Ag3.5 solder bumps. In general, during FEM based material modelling the coefficients of the material laws need to be stepwise changed until the right behaviour occurs. These iterations can stretch over a long time. The improved analytical model shows the potential to shorten the coefficient determination of material laws

[1]  R. Darveaux,et al.  Constitutive relations for tin-based-solder joints , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[2]  H. Walter,et al.  Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[3]  K. Banerji,et al.  Constitutive relations for tin-based-solder joints , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[4]  R. Darveaux,et al.  Shear deformation of lead free solder joints , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[5]  Klaus-Jurgen Wolter,et al.  Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[6]  P. Marjadi Deformation Characteristics and Microstructural Evolution of SnAgCu Solder Joints , 2005 .

[7]  J. W. Morris,et al.  Creep properties of Sn-rich solder joints , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[8]  B. Michel,et al.  Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

[9]  J. Pang,et al.  Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[10]  S. Rzepka,et al.  Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints , 1998 .

[11]  J. Pang,et al.  Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).