Flip-Chip forMillimeter-Wave andBroadbandS3.2 Packaging

Emerging markets formm-wave wireless andsen- sorsystems aswell ashighbit-rate components demand forcost- effective packaging solutions. Flip-chip isoneofthemostpromis- ingapproaches inthis regard combining high-volume potential withexcellent high-frequency performance. Thetalk presents the different flip-chip concepts inuse, focusing onthemicrowave characteristics andapproaching thesubject fromthedesigner's point ofview. Basic electromagnetic properties oftheintercon- nects aswellasconsequences forchipandpackage design are discussed. Ascarrier substrates, conventional ceramics, thin-film, andLTCC-multilayer approaches arecovered. Experimental results forvarious applications document feasibility andcapabili- ties inthefrequency range upto100GHz.