Condition Monitoring of Additively Manufactured Injection Mould Tooling: A Review of Demands, Opportunities and Potential Strategies

Injection moulding (IM) is an important industrial process, known to be the most used plastic formation technique. Demand for faster cycle times and higher product customisation is driving interest in additive manufacturing (AM) as a new method for mould tool manufacturing. The use of AM offers advantages such as greater design flexibility and conformal cooling of components to reduce cycle times and increase product precision. However, shortcomings of metal additive manufacturing, such as porosity and residual stresses, introduce uncertainties about the reliability and longevity of AM tooling. The injection moulding process relies on high volumes of produced parts and a minimal amount of tool failures. This paper reviews the demands for tool condition monitoring systems for AM-manufactured mould tools; although tool failures in conventionally manufactured tooling are rare, they do occur, usually due to cracking, deflection, and channel blockages. However, due to the limitations of the AM process, metal 3D-printed mould tools are susceptible to failures due to cracking, delamination and deformation. Due to their success in other fields, acoustic emission, accelerometers and ultrasound sensors offer the greatest potential in mould tool condition monitoring. Due to the noisy machine environment, sophisticated signal processing and decision-making algorithms are required to prevent false alarms or the missing of warning signals. This review outlines the state of the art in signal decomposition and both data- and model-based approaches to determination of the current state of the tool, and how these can be employed for IM tool condition monitoring. The development of such a system would help to ensure greater industrial uptake of additive manufacturing of injection mould tooling, by increasing confidence in the technology, further improving the efficiency and productivity of the sector.

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