Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures
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Juan Ren | Xueyong Wei | P. Kinnell | R. Craddock | M. Ward
[1] A. Fink,et al. High temperature high accuracy piezoresistive pressure sensor based on smart-cut soi , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.
[2] S. Orain,et al. A constitutive single crystal model for the silicon mechanical behavior: applications to the stress induced by silicided lines and STI in MOS technologies , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
[3] Jiangang Du,et al. High-temperature single-crystal 3C-SiC capacitive pressure sensor , 2004, IEEE Sensors Journal.
[4] Yoshitada Isono,et al. Plastic deformation of nanometric single crystal silicon wire in AFM bending test at intermediate temperatures , 2002 .
[5] C. Kim,et al. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength , 2000 .
[6] S. M. Spearing,et al. On the flexural creep of single-crystal silicon , 2000 .
[7] M. Schmidt,et al. Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching , 1999 .
[8] Koji Sumino,et al. Deformation behavior of silicon , 1999 .
[9] J. Frühauf,et al. New aspects of the plastic deformation of silicon – prerequisites for the reshaping of silicon microelements , 1999 .
[10] M. Mehregany,et al. Silicon carbide MEMS for harsh environments , 1998, Proc. IEEE.
[11] A. A. Ned,et al. 6H-SiC pressure sensor operation at 600/spl deg/C , 1998, 1998 Fourth International High Temperature Electronics Conference. HITEC (Cat. No.98EX145).
[12] J. M. Noworolski,et al. Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures , 1996 .
[13] Mikio Bessho,et al. SOI Type Pressure Sensor for High Temperature Pressure Measurement , 1994 .
[14] M. Schmidt,et al. Design of sealed cavity microstructures formed by silicon wafer bonding , 1993 .
[15] P. Hirsch,et al. THE BRITTLE-DUCTILE TRANSITION IN SILICON , 1991 .
[16] Deepak Uttamchandani,et al. Measurement of Young's modulus and internal stress in silicon microresonators using a resonant frequency technique , 1990 .
[17] S. G. Roberts,et al. The brittle–ductile transition in silicon. I. Experiments , 1989, Proceedings of the Royal Society of London. A. Mathematical and Physical Sciences.
[18] J. Greenwood. Silicon in mechanical sensors , 1988 .
[19] Masataka Umeno,et al. Mechanical Properties of Heat-treated CZ–Si Wafers from Brittle to Ductile Temperature Range , 1982 .
[20] P. Haasen,et al. Kriechen von Silizium-Einkristallen , 1964 .
[21] J. Patel,et al. Macroscopic Plastic Properties of Dislocation‐Free Germanium and Other Semiconductor Crystals. I. Yield Behavior , 1963 .
[22] G. L. Pearson,et al. Deformation and fracture of small silicon crystals , 1957 .
[23] Chien-Hung Wu,et al. Fabrication and Testing of Single Crystalline 3C-SiC Piezoresistive Pressure Sensors , 2001 .
[24] S. M. Spearing,et al. Materials issues in microelectromechanical systems (MEMS) , 2000 .
[25] P. Haasen,et al. The Brittle-Ductile Transition of Silicon , 1987 .
[26] M. Paterson,et al. Brittle-Ductile Transition , 1978 .
[27] C. R. Barrett,et al. Creep and recovery of silicon single crystals , 1972 .
[28] M. Myshlyaev,et al. Dislocation Structure and Macroscopic Characteristics of Plastic Deformation at Creep of Silicon Crystals , 1969 .
[29] J. Wortman,et al. Young's Modulus, Shear Modulus, and Poisson's Ratio in Silicon and Germanium , 1965 .