A RIE process for submicron, silicon electromechanical structures
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[1] E. Bassous. Fabrication of novel three-dimensional microstructures by the anisotropic etching of , 1978, IEEE Transactions on Electron Devices.
[2] Reactive ion etching for submicron structures , 1981 .
[3] K.E. Petersen,et al. Silicon as a mechanical material , 1982, Proceedings of the IEEE.
[4] R. Howe,et al. Polycrystalline Silicon Micromechanical Beams , 1983 .
[5] R. Howe,et al. Stress in polycrystalline and amorphous silicon thin films , 1983 .
[6] Roger T. Howe,et al. Polycrystalline and amorphous silicon micromechanical beams: annealing and mechanical properties , 1983 .
[7] Summary Abstract: Step coverage in multiple pass sputter deposition , 1985 .
[9] R. Muller,et al. Pin joints, gears, springs, cranks, and other novel micromechanical structures , 1987 .
[10] D. B. Hicks,et al. Mesa structure formation using potassium hydroxide and ethylene diamine based etchants , 1988, IEEE Technical Digest on Solid-State Sensor and Actuator Workshop.
[11] William C. Tang,et al. Laterally Driven Polysilicon Resonant Microstructures , 1989 .
[12] Noel C. MacDonald,et al. Selective chemical vapor deposition of tungsten for microelectromechanical structures , 1989 .
[13] T. Christenson,et al. Fabrication of micromechanical devices from polysilicon films with smooth surfaces , 1989 .
[14] G. Delapierre. Micro-machining: A survey of the most commonly used processes , 1989 .
[15] Anisotropic Reactive Ion Etching of Aluminum Using Cl2, BCl3, and CH 4 Gases , 1990 .
[16] K. Yamada,et al. A novel silicon accelerometer with a surrounding mass structure , 1990 .
[17] Anisotropic Reactive Ion Etching of Aluminum Using Cl2, BCl3, and CH4 Gases. , 1990 .
[18] P. Ratnam,et al. Characterization of BCl3 ‐ Cl2 Silicon Trench Etching , 1990 .