论文信息 - New acceleration factors for temperature, humidity, bias testing

New acceleration factors for temperature, humidity, bias testing

New temperature-humidity acceleration factors for surface conductance (G) were determined. These can be used to relate device life in a high-stress laboratory environment to device life in a normal-use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.

N.L. Sbar | R.P. Kozakiewicz

[1] H. Koelmans,et al. The Cathodic Corrosion of Aluminum , 1976 .

[2] D. S. Peck,et al. Temperature-Humidity Acceleration of Metal-Electrolysis Failure in Semiconductor Devices , 1973 .

[3] J. D. Bernal,et al. A Theory of Water and Ionic Solution, with Particular Reference to Hydrogen and Hydroxyl Ions , 1933 .

[4] G. A. Parks,et al. Electrical conductivity of silica gel in the presence of adsorbed water , 1968 .

[5] H. Koelmans,et al. Metallization Corrosion in Silicon Devices by Moisture-Induced Electrolysis , 1974 .

[6] J. M. Morabito,et al. Corrosion of solder-coated TiPdAu thin film conductors in a moist chlorine atmosphere , 1977 .

[7] D. Jaffe,et al. Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV Dispersion , 1976 .

[8] M. L. White,et al. Encapsulation of integrated circuits , 1969 .

[9] D. S. Peck,et al. The reliability of semiconductor devices in the bell system , 1974 .

[10] D. S. Peck,et al. The Analysis of Data from Accelerated Stress Tests , 1971 .

[11] N. Sbar,et al. Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl 2 , 1976 .

[12] Alex Shumka,et al. Migrated-Gold Resistive Shorts in Microcircuits , 1975, 13th International Reliability Physics Symposium.

[13] James A Cunningham,et al. Corrosion Resistance of Several Integrated-Circuit Metallization Systems , 1970 .