Fabrication of two-layer flexible copper clad laminate by electroless-Cu plating on surface modified polyimide
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S. Jung | Hoo-Jeong Lee | S. M. Hwang | C. Lee | E. Park | J. Joo | J. Choi | J. T. Lim | Chang Min Lee | Seung-Boo Jung | J. Lim | J. T. Lim | Seung-Boo Jung