论文信息 - Through-Glass Vias for MEMS Packaging - 字舞流文

Through-Glass Vias for MEMS Packaging

G. Wang | M. Huttula | W. Cao | Zhong-jia Huang | Xinying Shi | S. Saukko | M. Alatalo | Sergei Posysaev | O. Miroshnichenko | Zhongjia Huang

[1] H. Kirino,et al. A 76 GHz Multi-Layered Phased Array Antenna Using a Non-Metal Contact Metamaterial Waveguide , 2012, IEEE Transactions on Antennas and Propagation.

[2] N. Kukutsu,et al. 120-GHz-Band Wireless Link Technologies for Outdoor 10-Gbit/s Data Transmission , 2012, IEEE Transactions on Microwave Theory and Techniques.