Active control of circuit cooling conditions for transient thermal measurement purposes

This paper presents a practical realization of the circuit for the active control of cooling conditions for transient thermal measurements of a tested device or package with the dual cold plate cooling assembly equipped with Peltier thermoelectric modules. The operation of the realized control system is illustrated here based a practical example where the cooling conditions on both sides of a power diode package are actively adjusted so as to impose isothermal conditions independently from the amount of power dissipated in the device.

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