II-2 – Cylindrical Magnetron Sputtering
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[1] E. Kay,et al. Efficient Low Pressure Sputtering in a Large Inverted Magnetron Suitable for Film Synthesis , 1965 .
[2] M. Wutz. Getter-ion pumps of the magnetron type and an attempted interpretation of the discharge mechanism , 1969 .
[3] J. Harvey,et al. Sputtering yields of gold and tantalum in argon-oxygen mixtures , 1970 .
[4] T. Abe,et al. The deposition rate of metallic thin films in the reactive sputtering process , 1975 .
[5] R. Adams,et al. Measurement of Sticking Probabilities of Gases Adsorbed on Metal Films , 1972 .
[6] N. Sato,et al. LOW‐FREQUENCY OSCILLATIONS IN COAXIAL CYLINDRICAL DISCHARGE TUBES IN A MAGNETIC FIELD PERPENDICULAR TO AN ELECTRIC FIELD , 1964 .
[7] D. W. Hoffman,et al. The compressive stress transition in Al, V, Zr, Nb and W metal films sputtered at low working pressures☆ , 1977 .
[8] E. Hirsch. On the mechanism of the Penning discharge , 1964 .
[9] H. S. Butler,et al. Plasma Sheath Formation by Radio‐Frequency Fields , 1963 .
[10] N. Hosokawa,et al. Self-sputtering phenomena in high-rate coaxial cylindrical magnetron sputtering , 1977 .
[11] D. Campbell,et al. The mechanism of reactive sputtering , 1968 .
[12] J. Thornton,et al. Transparent conductive Sn‐doped indium oxide coatings deposited by reactive sputtering with a post cathode , 1976 .
[13] John A. Thornton,et al. Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings , 1975 .
[14] K. Mouthaan,et al. Statistical Theory of Electron Transport in the Smooth‐Bore Magnetron , 1966 .
[15] Y. Hatta,et al. MEASUREMENTS OF GROWTH AND DAMPING RATE OF RESISTIVE INSTABILITY IN GASEOUS PLASMA. , 1969 .
[16] W. Ott,et al. Sticking Coefficients for Atmospheric Gases Incident on Metallic Substrates , 1969 .
[17] L. Lamont,et al. Space Charge Instabilities in the rf Induced Gas Discharge of the Diode Configuration , 1970 .
[18] D. M. Mattox,et al. Structure Modification by Ion Bombardment during Deposition , 1972 .
[19] John A. Thornton,et al. Diagnostic methods for sputtering plasmas , 1978 .
[20] N. Sato,et al. LOW-FREQUENCY OSCILLATIONS IN A WEAKLY IONIZED PLASMA IN CROSSED ELECTRIC AND MAGNETIC FIELDS. , 1966 .
[21] A. B. Cannara,et al. Beam Probing of rf Beam/Plasma Interactions , 1965 .
[22] John A. Thornton,et al. The influence of bias sputter parameters on thick copper coatings deposited using a hollow cathode , 1977 .
[23] P. A. Redhead,et al. OPERATION OF AN INVERTED-MAGNETRON GAUGE IN THE PRESSURE RANGE 10−3 TO 10−12 MM. Hg , 1958 .
[24] K. Wasa,et al. Excitation of Rotational Oscillation in a Crossed Field Discharge , 1964 .
[25] J. Keller,et al. The rf glow‐discharge sputtering model , 1977 .
[26] K. Wasa,et al. Discharges between Coaxial Cylinders in a Magnetic Field , 1965 .
[27] W. Westwood,et al. A spectroscopic investigation of the reactive sputtering of aluminium , 1971 .
[28] David P. Smith. SCATTERING OF LOW-ENERGY NOBLE GAS IONS FROM METAL SURFACES. , 1967 .
[29] H. F. Winters. The growth of nitrided surface layers by ion bombardment , 1972 .
[30] R. L. Jepsen. Magnetically Confined Cold‐Cathode Gas Discharges at Low Pressures , 1961 .
[31] G. Carter. Ion Reflection, Penetration, and Entrapment in Solids , 1970 .
[32] N. Ivanov,et al. dc magnetron system for cathode sputtering , 1976 .
[33] R. Tsui,et al. Calculation of Ion Bombarding Energy and Its Distribution in rf Sputtering , 1968 .
[34] K. Wasa,et al. Reactively sputtered titanium resistors, capacitors and rectifiers for microcircuits , 1967 .
[35] R. Levy. Diocotron Instability in a Cylindrical Geometry , 1965 .
[36] T. Rognlien,et al. Low-frequency flute instabilities of a hollow cathode arc discharge - Theory and experiment. , 1973 .
[37] K. Wasa,et al. Efficient sputtering in a cold-cathode discharge in magnetron geometry , 1967 .
[38] H. F. Winters,et al. The chemisorption of nitrogen at activated sites on a polycrystalline tungsten surface , 1971 .
[39] K. Wasa,et al. Instability of Rotating Electron Sheath in Crossed Field Device , 1965 .
[40] E. Hooper. Cross Field Convection of Plasma in a Partially Ionized Gas , 1970 .
[41] A. W. Hull. The Effect of A Uniform Magnetic Field on the Motion of Electrons Between Coaxial Cylinders. , 1921 .
[42] K. Wasa,et al. Suppression of Instabilities in a Coaxial Discharge , 1965 .
[43] J. Thornton. Magnetron sputtering: basic physics and application to cylindrical magnetrons , 1978 .
[44] John A. Thornton,et al. Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings , 1974 .
[45] J. Heller,et al. Reactive sputtering of metals in oxidizing atmospheres , 1973 .
[46] J. B. Fisk,et al. The magnetron as a generator of centimeter waves , 1946 .
[47] F. M. Penning. Die glimmentladung bei niedrigem druck zwischen koaxialen zylindern in einem axialen magnetfeld , 1936 .
[48] G. K. Wehner,et al. Sputtering Yields of Metals for Ar+ and Ne+ Ions with Energies from 50 to 600 ev , 1961 .
[49] J. Thornton. High Rate Thick Film Growth , 1977 .
[50] D. W. Hoffman,et al. Internal stresses in sputtered chromium , 1977 .
[51] A. H. Beck,et al. A cylindrical magnetron ionisation gauge , 1952 .
[52] H. F. Winters,et al. GAS INCORPORATION INTO SPUTTERED FILMS. , 1967 .
[53] R. L. Jepsen,et al. Electrical Characteristics of a Penning Discharge , 1961, Proceedings of the IRE.
[54] F. Shinoki,et al. Mechanism of rf reactive sputtering , 1975 .
[55] D. Oblas,et al. Argon entrapment in metal films by dc triode sputtering , 1975 .
[56] G. Dunn,et al. Electron Impact Ionization Cross Section Data for Atoms, Atomic Ions and Diatomic Molecules: I. Experimental Data , 1965 .
[57] F. C. Hoh. Instability of Penning‐Type Discharges , 1963 .
[58] D. Kerr. Helical Instability in a Penning Discharge , 1966 .
[59] T. Yamashina,et al. Sorption Rate at Low Pressures of Oxygen by Titanium , 1971 .
[60] W. Knauer. Mechanism of the Penning Discharge at Low Pressures , 1962 .
[61] T. Yamashina,et al. Sorption of Nitrogen at Low Pressures by Titanium , 1972 .
[62] D. W. Hoffman,et al. Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputtering , 1977 .
[63] D. Oblas,et al. ARGON CONCENTRATION IN TUNGSTEN FILMS DEPOSITED BY dc SPUTTERING. , 1970 .
[64] P. Stuart. Some measurements of stress in thin films prepared by low pressure triode sputtering , 1969 .
[65] P. A. Redhead,et al. THE TOWNSEND DISCHARGE IN A COAXIAL DIODE WITH AXIAL MAGNETIC FIELD , 1958 .
[66] K. Wasa,et al. Sputtering in a Crossed Electromagnetic Field , 1967 .
[67] P. A. Redhead,et al. THE MAGNETRON GAUGE: A COLD-CATHODE VACUUM GAUGE , 1959 .
[68] T. Allen,et al. The appearance of some oscillating discharges , 1955 .
[69] L. I. Maissel,et al. Dielectric Thin Films through rf Sputtering , 1966 .
[70] E. Kay,et al. Ion implantation during film growth and its effect on the superconducting properties of niobium , 1975 .
[71] H. F. Winters. Sputtering of Chemisorbed Nitrogen with Ar , 1971 .
[72] R. C. Sun,et al. The origin of internal stress in low−voltage sputtered tungsten films , 1975 .
[73] K. Wasa,et al. Low Pressure Sputtering System of the Magnetron Type , 1969 .
[74] J. Thornton,et al. Tubular hollow cathode sputtering onto substrates of complex shape , 1975 .