Integration and electrical isolation in CMOS mixed-signal wireless chips

The technological trends underlying the application of CMOS technology in wireless applications are leading to the integration of the RF analog functions and the digital baseband processing into a single chip. Two key technical requirements for this integration are the capability to fabricate high Q passive components and the need to maintain electrical isolation between analog and digital components in the resulting mixed-signal chip. Some basic arguments that illustrate the technological conflict between these two important demands are presented, focusing on their implications for the structure of the IC substrate. This structure and the characteristics of the device package play important robs in determining the levels of coupled ground noise that will be present in the mixed-signal IC. A simple, high-level model for coupled ground noise is presented and used to illustrate the impact of design alternatives for the package and for the IC substrate.

[1]  M. Steyaert,et al.  A single-chip CMOS transceiver for DCS-1800 wireless communications , 1998, 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, ISSCC. First Edition (Cat. No.98CH36156).

[2]  B. M. Guenin,et al.  Analysis of thermally-enhanced SOIC packages , 1996 .

[3]  Asad A. Abidi,et al.  A single-chip 900-MHz spread-spectrum wireless transceiver in 1-μm CMOS. II. Receiver design , 1998, IEEE J. Solid State Circuits.

[4]  Asad A. Abidi,et al.  A single-chip 900-MHz spread-spectrum wireless transceiver in 1-/spl mu/m CMOS. I. Architecture and transmitter design , 1998 .

[5]  Shoichi Masui,et al.  Experimental results and modeling techniques for substrate noise in mixed-signal integrated circuits , 1993 .

[6]  Masao Hotta,et al.  Measurement of digital noise in mixed-signal integrated circuits , 1995 .

[7]  Asad A. Abidi.  Direct-conversion radio transceivers for digital communications , 1995 .

[8]  Jiayuan Fang,et al.  Modeling of Delta-I noise in digital electronics packaging , 1994, Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).

[9]  S. Mehta,et al.  A single-chip CMOS direct-conversion transceiver for 900 MHz spread-spectrum digital cordless phones , 1999, 1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition (Cat. No.99CH36278).

[10]  Rob A. Rutenbar,et al.  A methodology for rapid estimation of substrate-coupled switching noise , 1995, Proceedings of the IEEE 1995 Custom Integrated Circuits Conference.

[11]  Robert H. Walden,et al.  Performance trends for analog to digital converters , 1999, IEEE Commun. Mag..

[12]  David J. Allstot,et al.  Verification techniques for substrate coupling and their application to mixed-signal IC design , 1996 .

[13]  R. C. Frye.  MCM-D implementation of passive RF components: Chip/package tradeoffs , 1998, Proceedings. 1998 IEEE Symposium on IC/Package Design Integration (Cat. No.98CB36211).

[14]  Robert G. Meyer,et al.  Modeling and analysis of substrate coupling in integrated circuits , 1996 .

[15]  Bruce A. Wooley,et al.  The effects of switching noise on an oversampling A/D converter , 1995, Proceedings ISSCC '95 - International Solid-State Circuits Conference.

[16]  Toshiro Tsukada,et al.  Voltage-comparator-based measurement of equivalently sampled substrate noise waveforms in mixed-signal integrated circuits , 1996 .

[17]  D. A. Dunnett.  Classical Electrodynamics , 2020, Nature.

[18]  Rob A. Rutenbar,et al.  Addressing substrate coupling in mixed-mode ICs: simulation and power distribution synthesis , 1994, IEEE J. Solid State Circuits.

[19]  Ii Leon W. Couch.  Digital and analog communication systems , 1983 .

[20]  D. J. Allstot,et al.  Computer-aided design considerations for mixed-signal coupling in RF integrated circuits , 1998 .

[21]  Lawrence E. Larson.  Integrated circuit technology options for RFICs-present status and future directions , 1998 .

[22]  J. Lau,et al.  Experimental results and modeling of noise coupling in a lightly doped substrate , 1996, International Electron Devices Meeting. Technical Digest.

[23]  P. Wambacq,et al.  A design experiment for measurement of the spectral content of substrate noise in mixed-signal integrated circuits , 1999, 1999 Southwest Symposium on Mixed-Signal Design (Cat. No.99EX286).

[24]  Michiel Steyaert,et al.  A single-chip 900 MHz CMOS receiver front-end with a high performance low-IF topology , 1995, IEEE J. Solid State Circuits.

[25]  Ronald A. Rohrer,et al.  Expected current distributions for CMOS circuits , 1996, ICCAD 1996.

[26]  Thomas H. Lee,et al.  The Design of CMOS Radio-Frequency Integrated Circuits: RF CIRCUITS THROUGH THE AGES , 2003 .

[27]  Alper Demir,et al.  Modeling and simulation of the interference due to digital switching in mixed-signal ICs , 1999, 1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051).