Improving graduate packaging education through international cooperation

A cooperative research program between the Technical University of I\menao (Gemany) and the University of Arizona (USA) is described. Combining personnel visits with Intemet-based communication, including design files, etc. was found to be a very effective way of conducting the research. Results are discussed which are the result of contributions from both universities. I. Introduction Research in advanced packaging solutions requires the capability to fabricate appropriate structures for experimental investigation of electrical, thermal or mechanical characteristics as well as the ability to investigate performance characteristics through modeling and simulation software, The experimental investigation of performance characteristics requires measurement equipment as well as other equipment and instrumentation. Examples of this other equipment are high-frequency electrical probing stations, lowspeed wind tunnels, and interferometric strain measurement apparatus. Capital investment in fabrication technology, high frequency measurement capabilities, and desigdsimulation tools is a substantial expense. Continuing support costs are also high. The advisability and the necessity of a university attempting to attain world-class capabilities in all three areas is questionable. Cooperation with industrial firms to obtain access to advanced technology is possible, but is made difficult due to differing goals, time scales and priorities. Leading-edge research is however a necessruy component for graduate-level education. Students are required to write a thesis or dissertation, and one or more papers must be published before the student can graduate. Only advanced research will enable the student to satisfy the publication requirement. To solve these problems and limitations discussed earlier, we have engaged in an intemational cooperative program, which joins the technology of two universities, each with considerable expertise in one or more

[1]  John L. Prince,et al.  Accurate frequency domain modeling of LTCC solid‐gridded plane structures , 2003 .

[2]  G. Winkler,et al.  Modeling the performance of embedded gridded plane structures in LTCC , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[3]  Guang Chen,et al.  Frequency domain behavior of solid and gridded reference power/ground planes in LTCC modules , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).