In line die cleaning apparatus and method for semiconductor molding equipments

Here, the in-line mold cleaning apparatus is disclosed for plasma cleaning the upper die and the at least one mold of the lower mold installed on the semiconductor molding equipment in-line. Mold cleaning apparatus disclosed in-line, forms the upper mold and the lower mold when the mold and the at least one chamber to be of consistent and washed configured to generate a plasma in the chamber module; And a transfer unit for transferring the cleaning module to the cleaning position of the air between the upper mold and the lower mold from the starting position; It comprises a lifting unit for lifting the cleaning module for cleaning the cleaning module of the standby position to the upper mold or the lower mold where the fitting with the. In-line, the mold, the cleaning module, a plasma, a two-way, one-way, the chamber, the molding,