Advanced reliability study on high temperature automotive electronics

To ensure high reliability for advanced automotive electronics, investigation and understanding on the failure mechanisms under harsh conditions are needed. New methods and technologies for improved reliability and increased lifetime should be developed. In this paper, an investigation on the effect of high temperature aging on the thermomechanical properties, microstructure of the molding compounds and the reliability issues of the packages is presented. Experimental characterizations of aging effect on the packaging materials and the package were carried out. DMA, TMA and TGA were used to measure the moduli, coefficients of thermal expansion (CTE), and the shrinkage induced by the aging process. Construction analysis was performed to examine the aging effect on the microstructure of the aged samples. It is found that aging has significant influence on the rubbery modulus, the glass transition temperature (Tg) and the strength. Aging-induced shrinkage was also found. Oxidation is believed to be one of the main mechanisms for the degradation of the material properties.

[1]  K.M.B. Jansen,et al.  Effect of postcure and thermal aging on molding compound properties , 2009, 2009 11th Electronics Packaging Technology Conference.

[2]  Uwe Scheuermann,et al.  Reliability challenges of automotive power electronics , 2009, Microelectron. Reliab..

[3]  Olaf van der Sluis,et al.  On the epoxy moulding compound aging effect on package reliability , 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[4]  W.H. Zhu,et al.  Mechanical properties of molding compounds (MCs) under different moisture conditions and in a wide temperature range , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

[5]  A. Teverovsky.  Effect of environments on degradation of molding compound and wire bonds in PEMs , 2006, 56th Electronic Components and Technology Conference 2006.

[6]  Samit Roy,et al.  Modeling of evolving damage in high temperature polymer matrix composites subjected to thermal oxidation , 2008 .

[7]  June-Kyun Park,et al.  Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength , 2007, IEEE Transactions on Components and Packaging Technologies.