Optimal Placement of Eletronic Devices in Forced Convective Cooling Conditions

Implementation of genetic algorithm for electronic devices placement optimization has been done. The study includes a few cases. In the first attempt electronic devices are placed along a bottom surface of a duct and cooled with forced convection by air stream with velocity U0. Thermal model is two-dimensional (2D). Algorithm optimizes order and spacing in the view of three thermal criteria. In the second step genetic algorithm is used to optimize position of electronic devices on a surface of a printed circuit board (PCB). Thermal model is three-dimensional (3D). Devices have some specified positions on the PCB and permutations are only performed. Algorithm optimizes electronic devices position from the view of thermal criteria and wiring length.

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