Method for soldering flip chip on base plate and packaging apparatus

The invention discloses a method for soldering a flip chip on a base plate and a packaging apparatus. The method comprises the following steps: manufacturing one of a solder ball bump or a copper pillar on the flip chip; overlapping one or more solder balls on the solder ball bump or the copper pillar, or manufacturing one or more solder balls overlapped on the solder ball bump or the copper pillar on the base plate; and soldering the flip chip on the base plate. By using the technical scheme provided by the invention, the problem that a soldering spot between the chip and the base plate is easy to deform to cause the low reliability of the packaging apparatus in the prior art is solved.