论文信息 - Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders

Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders

Abstract The formation of Ni 3 P layers in Sn(Cu)/Ni(P) reaction couples were limited compared to Sn/Ni(P). The sluggish growth of the Ni 3 P layer was attributed to a Cu–Sn compound layer formed on the Ni(P) substrate, and it depended on the Ni diffusion in the Cu–Sn compound.

S. Wang | C. Y. Liu | S. J. Wang | C. Y. Liu

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