A New Circuit Model for Carbon Nanotube Interconnects With Diameter-Dependent Parameters

In this paper, a new circuit model for the propagation of electric signals along carbon nanotube interconnects is derived from a fluid model description of the nanotube electrodynamics. The conduction electrons are regarded as a 2-D charged fluid, interacting with the electromagnetic field produced by the ion lattice, the conduction electron themselves, and the external sources. This interaction may be assumed to be governed by a linearized Euler's equation, which provides the nanotube constitutive equation to be coupled to Maxwell equations. A derivation of a circuit model is then possible within the frame of the classical multiconductor transmission-line (TL) theory. The elementary cell of this TL model differs from those proposed in literature, due to the definition of the circuit variable corresponding to the voltage. When considering small nanotube radius, we obtain values for the kinetic inductance and quantum capacitance that are consistent with literature. These values are corrected here to take into account the influence of larger values of radius properly. Conversely, the value of the per unit length resistance is roughly half of the value usually adopted in literature. The multiconductor TL model is used to study the scaling law of the parameters with the number of carbon nanotubes in a bundle.

[1]  S. Datta,et al.  Transport effects on signal propagation in quantum wires , 2005, IEEE Transactions on Electron Devices.

[2]  Dekker,et al.  High-field electrical transport in single-wall carbon nanotubes , 1999, Physical review letters.

[3]  P. Burke,et al.  An RF circuit model for carbon nanotubes , 2002, Proceedings of the 2nd IEEE Conference on Nanotechnology.

[4]  M. Dresselhaus,et al.  Physical properties of carbon nanotubes , 1998 .

[5]  S. Iijima.  Helical microtubules of graphitic carbon , 1991, Nature.

[6]  John J. Plombon,et al.  High-frequency electrical properties of individual and bundled carbon nanotubes , 2007 .

[7]  Y. Massoud,et al.  Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques , 2006, IEEE Transactions on Electron Devices.

[8]  G. Slepyan,et al.  Electrodynamics of carbon nanotubes , 2019, Carbon-Based Nanoelectromagnetics.

[9]  R. Smalley.  Crystalline Ropes of Metallic Carbon Nanotubes , 1999 .

[10]  Kaustav Banerjee,et al.  Are carbon nanotubes the future of VLSI interconnections? , 2006, 2006 43rd ACM/IEEE Design Automation Conference.

[11]  G. Miano,et al.  An Integral Formulation for the Electrodynamics of Metallic Carbon Nanotubes Based on a Fluid Model , 2006, IEEE Transactions on Antennas and Propagation.

[12]  P. Burke,et al.  Microwave transport in metallic single-walled carbon nanotubes. , 2005, Nano letters.

[13]  A. Fetter,et al.  Electrodynamics of a layered electron gas. I. Single layer , 1973 .

[14]  E. J. Mele,et al.  Electronic structure of carbon nanotube ropes , 2000 .

[15]  G. Miano,et al.  Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects , 2008, IEEE Transactions on Advanced Packaging.

[16]  Charles M. Lieber,et al.  Diameter-Controlled Synthesis of Carbon Nanotubes , 2002 .

[17]  A. Fetter,et al.  Electrodynamics of a layered electron gas. II. Periodic array , 1974 .

[18]  A. Lakhtakia,et al.  Electromagnetic wave propagation in an almost circular bundle of closely packed metallic carbon nanotubes , 2007, 0705.2866.

[19]  A. V. Gusakov,et al.  Electrodynamics of carbon nanotubes: Dynamic conductivity, impedance boundary conditions, and surface wave propagation , 1999 .

[20]  Kaushik Roy,et al.  Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies , 2006, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[21]  A. Maffucci,et al.  A transmission line model for metallic carbon nanotube interconnects , 2008, Int. J. Circuit Theory Appl..

[22]  Mei Liu,et al.  Inductance of mixed carbon nanotube bundles , 2007 .

[23]  W. Hoenlein,et al.  Carbon nanotube applications in microelectronics , 2004, IEEE Transactions on Components and Packaging Technologies.

[24]  M. P. Anantram,et al.  Physics of carbon nanotube electronic devices , 2006 .

[25]  J. Wesstrom.  Signal propagation in electron waveguides: Transmission-line analogies , 1996 .

[26]  J. Meindl,et al.  Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI) , 2005, IEEE Electron Device Letters.

[27]  P. McEuen,et al.  Electron-Phonon Scattering in Metallic Single-Walled Carbon Nanotubes , 2003, cond-mat/0309641.

[28]  Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects , 2007, 2007 IEEE Workshop on Signal Propagation on Interconnects.

[29]  P. Burke.  Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes , 2002 .

[30]  M. Hagmann,et al.  Isolated carbon nanotubes as high-impedance transmission lines for microwave through terahertz frequencies , 2005, IEEE Transactions on Nanotechnology.

[31]  S. Wind,et al.  Carbon nanotube electronics , 2002, Digest. International Electron Devices Meeting,.