Ultrasonic-Driven Spreading of Liquid Solder on Nonwetting Substrates

In this work, the spreading of a solder droplet on a substrate agitated by ultrasonic vibration was recorded by a high-speed camera. The dynamics and physical processes of the spreading, such as corrugate formation and atomization, were investigated. Results showed the solder droplet was able to spread on a nonwetting substrate, and it presented periodic expanding-shrinking spreading characteristics with a periodicity of dozens of acoustic periods. Corrugates formed as a result of the capillary wave propagation on the droplet, and the formation became intensive on a violently vibrating surface. Atomization preferentially occurred at the spreading front during solder expansion, where the liquid solder appeared as a film and burst on the whole droplet with strong vibration. High ultrasonic power resulted in fast spreading and a large spreading diameter. In particular, the solder droplet exhibited fast spreading and a large spreading diameter on the TC4 alloy with high characteristic impedance. The Sn-4Cu solder with large viscosity spread slowly and exhibited a small spreading diameter.

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