Preparation and thermal stability of amine-terminated polyesterimide modified epoxy resin

[1]  K. Fukukawa,et al.  Synthesis and properties of multi-block semi-alicyclic polyimides for thermally stable transparent and low CTE film , 2013 .

[2]  D. Gui,et al.  Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin , 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

[3]  H. Noguchi,et al.  On the micromechanism of hydrogen-assisted cracking in a single-crystalline iron–silicon alloy thin sheet , 2011 .

[4]  A. Asif,et al.  Synthesis and properties of cationic photopolymerizable hyperbranched polyesters with terminal oxetane groups by the couple-monomer polymerization of carboxylic anhydride with hydroxyl oxetane , 2010 .

[5]  Yoshio Kobayashi,et al.  Poly(ester imide)s possessing low coefficients of thermal expansion (CTE) and low water absorption (III). Use of bis(4-aminophenyl)terephthalate and effect of substituents , 2010 .

[6]  S. Hong,et al.  Enhanced electrical conductivity of nanocomposites containing hybrid fillers of carbon nanotubes and carbon black. , 2009, ACS applied materials & interfaces.

[7]  B. Love,et al.  Analyzing the dynamic chemorheology of curing resins: Extraction of model parameters associated with cure advancement , 2007 .

[8]  Jang‐Kyo Kim,et al.  Effects of silane functionalization on the properties of carbon nanotube/epoxy nanocomposites , 2007 .

[9]  L. Jian The Failure of PEM Caused by the Mismatch of CTE , 2007 .

[10]  S. Hsiao,et al.  Soluble and Colorless Poly(ether‐imide)s Based on a Benzonorbornane Bis(ether anhydride) and Trifluoromethyl‐Substituted Aromatic Bis(ether‐amine)s , 2006 .

[11]  K. Madhavan,et al.  Synthesis of novel soluble poly(imide-siloxane)s via hydrosilylation: Characterization and structure property behaviour , 2006 .

[12]  A. K. Banthia,et al.  Amine-terminated poly(ethylene glycol) benzoate (ATPEGB)-modified epoxy: mechanical and thermal properties , 2006 .

[13]  M. Lakshmi,et al.  Chemistry of Siloxane Amide as a New Curing Agent for Epoxy Resins: Material Characterization and Properties , 2005 .

[14]  A. K. Banthia,et al.  Amine terminated poly(ethylene glycol) benzoate modified epoxy networks , 2005 .

[15]  A. Tayebali,et al.  Material Characterization and Performance Properties of Superpave Mixtures , 2004 .

[16]  Horng-Jer Tai,et al.  Chemical shrinkage and diffusion-controlled reaction of an epoxy molding compound , 2000 .

[17]  S. Hsiao,et al.  Organosoluble optically transparent poly(ether imide)s based on a tert‐butylhydroquinone bis(ether anhydride) , 2000 .

[18]  Chun-Shan Wang,et al.  Modification of epoxy resins with polysiloxane TPU for electronic encapsulation. II , 1996 .

[19]  Chun-Shan Wang,et al.  Synthesis and modification of trifunctional epoxy resin with amine terminated polydimethyl siloxanes for semiconductor encapsulation application , 1996 .

[20]  D. Vollath,et al.  Mechanical and Thermal Properties , 1986 .