Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization
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Yi-Shao Lai | Ying-Ta Chiu | Chiu-Wen Lee | Y. Lai | C. Lee | Y. Chiu
[1] Sinn-wen Chen,et al. Phase equilibria of the Ag–Sn–Cu ternary system , 2004 .
[2] Y. Lai,et al. Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing , 2008 .
[3] Yi-Shao Lai,et al. Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages , 2006, Microelectron. Reliab..
[4] King-Ning Tu,et al. Relieving the current crowding effect in flip-chip solder joints during current stressing , 2006 .
[5] Tomi Laurila,et al. Interfacial reactions between lead-free solders and common base materials , 2005 .
[6] C. MacKay,et al. Barrier Layers Against Diffusion , 1979 .
[7] King-Ning Tu,et al. Effect of current crowding on vacancy diffusion and void formation in electromigration , 2000 .
[8] K. Tu,et al. Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .
[9] Yi-Shao Lai,et al. Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects , 2007 .
[10] Y. Lai,et al. Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization , 2008, 2008 58th Electronic Components and Technology Conference.
[11] J. J. Lee,et al. A study in flip-chip UBM/bump reliability with effects of SnPb solder composition , 2006, Microelectron. Reliab..
[12] Y. C. Chan,et al. GROWTH KINETICS OF INTERMETALLIC COMPOUNDS IN CHIP SCALE PACKAGE SOLDER JOINT , 2001 .
[13] Yi-Shao Lai,et al. Electromigration Reliability and Morphologies of 62Sn–36Pb–2Ni and 62Sn–36Pb–2Cu Flip-Chip Solder Joints , 2007, IEEE Transactions on Components and Packaging Technologies.
[14] Y. C. Chuang,et al. Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps , 2006 .
[15] Y. Lai,et al. Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis , 2006 .
[16] Y. L. Lin,et al. Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration , 2006 .
[17] Y. L. Lin,et al. Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations , 2005 .
[18] Hyuck-Mo Lee,et al. Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation , 1997 .
[19] Kwang-Lung Lin,et al. Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration , 2005 .
[20] C. Handwerker,et al. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys , 2000 .
[21] Kazuaki Ano,et al. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability , 2005 .
[22] King-Ning Tu,et al. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization , 2003 .
[23] Yi-Shao Lai,et al. Characteristics of current crowding in flip-chip solder bumps , 2006, Microelectron. Reliab..
[24] Yi-Shao Lai,et al. Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..
[25] Yi-Shao Lai,et al. Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy , 2007, Microelectron. Reliab..