论文信息 - Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers - 字舞流文

Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers

J. Lau | J. Lo | C. Ko | R. Beica | Zhang Li | K. Tan | Ming Li | Ricky S. W. Lee | Y. Cheung | N. Fan | E. Kuah | Wu Kai | Margie Li | J. Hao | Henry Yang | S. Lim | Jiang Ran | Cao Xi | Koh Sau Wee | Q. Yong | Tony Chen | Iris Xu | Mian Tao | Lei Yang | Zhong Cheng | Eric Ng | Penny Lo | Nc Lee | Y. Chen