Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs

This paper derives and evaluates an effective thermal material simulation model in simula-tion and experiment as well as proposes a non-destructive failure analysis for multi-layer sub-strates with thermal or electrical vias to derive exact failure data to supplement existing life-time models.

[1]  Miss A.O. Penney.  (b) , 1974, The New Yale Book of Quotations.

[2]  Y. Shabany,et al.  Component size and effective thermal conductivity of printed circuit boards , 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

[3]  J. R. Culham,et al.  Factors affecting the calculation of effective conductivity in printed circuit boards [thermal analysis] , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).