Thermal stability and viscoelastic properties of MF/PVAc hybrid resins on the adhesion for engineered flooring in under heating system; ONDOL

Abstract The thermal properties of blends of melamine-formaldehyde (MF) resin and poly(vinyl acetate) (PVAc) for engineered flooring used on the Korean traditional ONDOL house floor heating system were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The viscoelastic properties of the blends were also studied. Because MF resin is a thermosetting adhesive, the effect of MF rein was shown across all thermal behaviors. The addition of PVAc reduced the curing temperature. The TGA results showed that the DTGmax temperature and thermal stability of the blends increased with increasing PVAc content. The blends were examined in non-isothermal DSC experiments at a heating rate of 10 °C/min. There was an exothermic peak in all the heating scanning curves, with each blend displaying a single curing peak temperature (Tp), intermediate between those of the two pure components and varying with the blend composition. The DMTA thermogram of MF resin showed that the storage modulus (E′) increased as the temperature was further increased as a result of the cross-linking induced by the curing reaction of the resin. E′ of MF resin increased both as a function of increasing temperature and with increasing heating rate.

[1]  S. Verma,et al.  Improvement in properties of poly(vinyl acetate): Emulsion with dibasic acids , 1986 .

[2]  R. Wetton,et al.  Theory and application of dynamic mechanical thermal analysis , 1991 .

[3]  Sumin Kim,et al.  Curing behavior and viscoelastic properties of pine and wattle tannin-based adhesives studied by dynamic mechanical thermal analysis and FT-IR-ATR spectroscopy , 2003 .

[4]  Sixun Zheng,et al.  Miscibility and phase behavior in thermosetting blends of polybenzoxazine and poly(ethylene oxide) , 2003 .

[5]  Gook-Sup Song,et al.  Buttock responses to contact with finishing materials over the ONDOL floor heating system in Korea , 2005 .

[6]  Sumin Kim,et al.  Comparison of standard methods and gas chromatography method in determination of formaldehyde emission from MDF bonded with formaldehyde-based resins. , 2005, Bioresource technology.

[7]  A. Pizzi,et al.  Diffusion hindrance vs. wood-induced catalytic activation of MUF adhesive polycondensation , 1995 .

[8]  László Bánhidi Radiant heating systems : design and applications , 1991 .

[9]  Tunga Salthammer,et al.  Organic Indoor Air Pollutants. Occurrence, Measurement, Evaluation , 1999 .

[10]  Y. Örs,et al.  Bonding strength of poly(vinyl acetate)‐based adhesives in some wood materials treated with impregnation , 2000 .

[11]  E. Leroy,et al.  Determination of activation energy and preexponential factor of thermoset reaction kinetics using differential scanning calorimetry in scanning mode: Influence of baseline shape on different calculation methods , 2000 .

[12]  Per Axel Clausen,et al.  The Danish Twin Apartment Study; Part I: Formaldehyde and Long‐Term VOC Measurements , 1991 .

[13]  Patrick Wäger,et al.  Volatile organic compounds and some very volatile organic compounds in new and recently renovated buildings in Switzerland , 1992 .

[14]  S. Hiziroglu,et al.  Effect of density and some of the production parameters on bending strength of laminated window profiles , 2004 .

[15]  J. Yeh,et al.  Preparation and properties of poly(vinyl alcohol)–clay nanocomposite materials , 2003 .

[16]  E. Dargent,et al.  Relaxations IN amorphous and semi-crystalline polyesters , 2004 .

[17]  Han-Seung Yang,et al.  Thermogravimetric analysis of rice husk flour filled thermoplastic polymer composites , 2004 .

[18]  P. H. Parsania,et al.  Thermal analysis of cured halogenated epoxy resins based on bisphenol-C , 2002 .

[19]  M. Ansell,et al.  Dynamic thermomechanical analysis as a control technique for thermoset bonding of wood joints , 1998 .

[20]  Sumin Kim,et al.  Effect of addition of polyvinyl acetate to melamine-formaldehyde resin on the adhesion and formaldehyde emission in engineered flooring , 2005 .

[21]  H. Mizumachi,et al.  Miscibility and peel strength of acrylic pressure‐sensitive adhesives: Acrylic copolymer–tackifier resin systems , 1995 .

[22]  K. Mansaray,et al.  Determination of kinetic parameters of rice husks in oxygen using thermogravimetric analysis , 1999 .

[23]  Sumin Kim,et al.  Comparison of formaldehyde emission from building finishing materials at various temperatures in under heating system; ONDOL. , 2005, Indoor air.

[24]  Bumjae Lee,et al.  Thermal properties of agro-flour-filled biodegradable polymer bio-composites , 2005 .