论文信息 - High performance air cooled heat sinks for integrated circuits

High performance air cooled heat sinks for integrated circuits

A simple, compact, high-performance air cooling technology is described that combines laminar flow with certain heat-sink designs to achieve a cooling performance of >

[1] R. Pease,et al. High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[2] M. Mahalingam. Thermal management in semiconductor device packaging , 1985, Proceedings of the IEEE.

[3] N. Goldberg,et al. Narrow Channel Forced Air Heat Sink , 1984 .

[4] Avram Bar-Cohen. Thermal Management of Air- and Liquid-Cooled Multichip Modules , 1987 .

[5] Sevgin Oktay,et al. A conduction-cooled module for high-performance LSI devices , 1982 .