论文信息 - TLP and HBM ESD test correlation for power ICs

TLP and HBM ESD test correlation for power ICs

This paper discusses a practical technique to accurately correlate package level ESD protection results by HBM (human body model) zapping and TLP (transmission line pulsing) testing. It is found that the ESD pulse duration plays a key role in correlating HBM and TLP testing results as verified by evaluating 40V-5V DC-DC convertor ICs.

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