Buckling Collapse Strength of Chip Carrier under Longitudinal Bending (1st Report)

Buckling collapse test was carried out on 1/10-scale hull girder models of an existing Chip Carrier applying pure bending load. Two models were provided with and without carlings at the upper part of the side shell plating. The test results indicate that the buckling collapse of the deck plating as a stiffened panel and the local buckling of the upper side shell plating lead to the overall collapse of a hull girder under the sagging condition. Theoretical analysis was performed on test models applying the Smith's method, and it was confirmed that the calculated results show similar characteristics with the measured results.