Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias

Three-dimensional integrated circuits (3D ICs) with advanced cooling systems are emerging as a viable solution for many-core platforms. These architectures generate a high and rapidly changing thermal flux. Their design requires accurate transient thermal models. Several models have been proposed, either with limited capabilities, or poor simulation performance. This work introduces an efficient algorithm based on the Finite Difference Method to compute the transient temperature in liquid-cooled 3D ICs. Our experiments show a 5x speedup versus state-of-the-art models, while maintaining the same level of accuracy, and demonstrate the effect of large through silicon vias arrays on thermal dissipation.

[1]  James Demmel,et al.  A Supernodal Approach to Sparse Partial Pivoting , 1999, SIAM J. Matrix Anal. Appl..

[2]  Chia-Lin Yang,et al.  Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling , 2011, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[3]  Zhuo Feng,et al.  Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling , 2010, 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

[4]  Jinson Koppanalil,et al.  A 1.6 GHz dual-core ARM Cortex A9 implementation on a low power high-K metal gate 32nm process , 2011, Proceedings of 2011 International Symposium on VLSI Design, Automation and Test.

[5]  Sung Kyu Lim,et al.  Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional IC With Non-Uniform Heat Flux , 2009 .

[6]  Gabriela Nicolescu,et al.  Explicit transient thermal simulation of liquid-cooled 3D ICs , 2013, 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE).

[7]  Young-Hyun Jun,et al.  A 1.2V 12.8GB/s 2Gb mobile Wide-I/O DRAM with 4×128 I/Os using TSV-based stacking , 2011, 2011 IEEE International Solid-State Circuits Conference.

[8]  David Atienza,et al.  3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling , 2010, 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

[9]  Gabriela Nicolescu,et al.  A linear-time approach for the transient thermal simulation of liquid-cooled 3D ICs , 2011, 2011 Proceedings of the Ninth IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS).

[10]  Sheldon X.-D. Tan,et al.  Full-chip thermal analysis of 3D ICs with liquid cooling by GPU-accelerated GMRES method , 2012, Thirteenth International Symposium on Quality Electronic Design (ISQED).

[11]  Anneli Folkesson,et al.  Numerical methods for engineers , 2007 .

[12]  David Atienza,et al.  Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks , 2012, GLSVLSI '12.

[13]  Jinggang Qin.  The new alternating direction implicit difference methods for solving three-dimensional parabolic equations , 2010 .