Phase diagram calculation on Sn–Zn–Ga solders

Abstract Sn–Zn eutectic system is one of the most promising lead-free solders with the advantages of low melting points, excellent mechanical properties and acceptable costs, whereas its poor wetting ability confines its applications in many substrates. In this paper, gallium (Ga) was added to the Sn–Zn eutectic system in order to improve its melting properties and wetting abilities. Piecing binary phase diagram method was employed to calculate the uncharted Sn–Zn–Ga ternary phase diagram and the eutectic point of this ternary system. Differential scanning calorimeter (DSC) method was used to exam the melting point of the solder system. The SnZn6Ga solder has a melting point of 174.4 °C, with wetting rate of 48.9%, while the melting point of Sn–Zn alloy is 198.5 °C and melting rate is only about 20%. In addition, the method of piecing binary phase diagrams proves to be feasible to clarify certain unknown ternary phase systems.