论文信息 - A wafer-bonded floating-element shear stress microsensor with optical position sensing by photodiodes

A wafer-bonded floating-element shear stress microsensor with optical position sensing by photodiodes

This paper discusses a noninvasive sensing technique for the direct measurement of low-magnitude shear stresses in laminar and turbulent air flows. The sensing scheme detects the flow-induced in-plane displacement of a microfabricated floating-element structure (500 /spl mu/m/spl times/500 /spl mu/m/spl times/7 /spl mu/m), using integrated photodiodes. The wall-mounted floating-element sensors were fabricated using a wafer-bonding technology. The sensors were calibrated in a custom-designed laminar flow cell and subsequently shown to be able to transduce shear stresses of 0.01 Pa during tests in a low-speed wind tunnel.

[1] F. White. Viscous Fluid Flow , 1974 .

[2] Joseph H. Haritonidis,et al. The Measurement of Wall Shear Stress , 1989 .

[3] H. Schlichting. Boundary Layer Theory , 1955 .

[4] Morton M. Denn,et al. Process Fluid Mechanics , 1979 .

[5] Kenneth S. Breuer,et al. Gaseous flow in small channels , 1993 .

[6] R. Howe,et al. Viscous damping model for laterally oscillating microstructures , 1994 .

[7] Martin A. Schmidt,et al. A microfabricated floating-element shear stress sensor using wafer-bonding technology , 1992 .

[8] R. Howe,et al. Design and calibration of a microfabricated floating-element shear-stress sensor , 1988 .

[9] S. M. Sze,et al. Physics of semiconductor devices , 1969 .

[10] S. Graham Kelly,et al. Fundamentals of Mechanical Vibrations , 1992 .

[11] J. B. Starr. Squeeze-film damping in solid-state accelerometers , 1990, IEEE 4th Technical Digest on Solid-State Sensor and Actuator Workshop.