A 1 ms High-Speed Vision Chip with 3 D-Stacked 140 GOPS Column-Parallel PEs for Diverse Sensing Applications

We have developed a 1/3.2-inch, 1.27Mpixel, 500fps (0.31Mpixel 1000fps 2x2 binning) vision chip with 3D stacked column-parallel Analog-to-Digital Converters (ADCs) and 140 Giga Operation Per Second (GOPS) programmable Single Instruction Multiple Data (SIMD) column-parallel PEs for diverse sensing applications. The 3D stacked structure and the column parallelized processing architecture achieve high sensitivity, high resolution and high accuracy object positioning for diverse sensing applications.

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