Design, simulation, fabrication, and characterization of package level micro shielding for EMI/EMC management in BGA environment

With the introduction of compact mixed signal assemblies and mixed signal integrated circuits, electromagnetic interference (EMI) and electromagnetic compatibility (EMC) problems have started to emerge on the package and chip levels. Mixed signal circuit partitions (digital/analog/RF) have to be implemented such that EMI/EMC effects can be controlled. EMI/EMC management is today primarily performed on the subsystem level. We explore here EMI/EMC management on the package level using design EM field simulation and measurements. We have identified micro-shielding as the most effective approach and explore it here theoretically and experimentally in the BGA packaging environment for frequencies up to 20 GHz.

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