Design and performance evaluation of Pentium/sup R/ III microprocessor packaging

This paper describes a design methodology to determine the number of chip capacitors needed and its placement scheme for the latest Pentium/sup R/ III microprocessor package substrate for optimum performance. The effect of capacitors on the power supply and its performance and placement schemes are discussed and compared against measurements. Performance improvements are outlined and compared between the current 0.13 /spl mu/m and the previous 0.18 /spl mu/m silicon package technology designed for compatibility with existing systems.