AMC control in photolithography: the past decade in review

The focus of airborne molecular contamination (AMC) control within the semiconductor industry, specifically photolithography, has changed significantly over the past decade. As the focal point of concern has shifted from ammonia (or base gases), to acid gases, and recently to organic contaminants, the filtration industry has adeptly grown to provide the necessary filtration solutions. This paper attempts to provide an overview of these changes while reviewing the primary contaminants, how they are removed, the control technologies in use, and how they are applied.

[1]  Carl E. Larson,et al.  Amine control for DUV lithography: identifying hidden sources , 2000, Advanced Lithography.

[2]  William D. Hinsberg,et al.  Airborne Contamination of a Chemically Amplified Resist. 2. Effect of Polymer Film Properties on Contamination Rate , 1994 .

[3]  W. Marsden I and J , 2012 .

[4]  William D. Hinsberg,et al.  Quantitation of airborne chemical contamination of chemically amplified resists using radiochemical analysis , 1992, Advanced Lithography.

[5]  Andrew J. Dallas,et al.  An investigation of perfluoroalkylamine contamination control , 2009, Advanced Lithography.

[6]  Andrew J. Dallas,et al.  Removal of low concentrations of acid gases: issues and solutions , 2005, SPIE Advanced Lithography.

[7]  Oleg P. Kishkovich,et al.  Contrarian approach to and ultimate solution for 193nm reticle haze , 2007, SPIE Advanced Lithography.

[8]  Roderick R. Kunz,et al.  Experimentation and modeling of organic photocontamination on lithographic optics , 2000 .

[9]  R. Stephenson A and V , 1962, The British journal of ophthalmology.

[10]  Scott A. MacDonald,et al.  Airborne chemical contamination of a chemically amplified resist , 1991, Other Conferences.

[11]  William D. Hinsberg,et al.  Airborne contamination of a chemically amplified resist. 1. Identification of problem , 1993 .

[12]  Andrew J. Dallas,et al.  Low pressure drop filtration of airborne molecular organic contaminants using open-channel networks , 2007, SPIE Advanced Lithography.

[13]  Andrew J. Dallas,et al.  Protecting the DUV process and optimizing optical transmission , 2000, Advanced Lithography.

[14]  Andrew J. Dallas,et al.  An investigation of the removal of 1-Methyl-2-Pyrrolidinone (NMP) , 2006, SPIE Advanced Lithography.

[15]  Andrew J. Dallas,et al.  New concerns with the design of filters for the protection of lithography optics , 2003, SPIE Advanced Lithography.

[16]  Steven Rowley Real-time optics contamination monitoring using surface acoustic wave technology , 2004, SPIE Advanced Lithography.

[17]  Andrew J. Dallas,et al.  Are ambient SO2 levels a valid indicator of projected acid gas filter life? , 2004, SPIE Advanced Lithography.

[18]  Kim Dean,et al.  Effects of airborne molecular contamination on 157-nm resists: AMC friend or foe? , 2004, SPIE Advanced Lithography.

[19]  David Ruede,et al.  New filter media development for effective control of trimethysilanol (TMS) and related low molecular weight silicon containing organic species in the photobay ambient , 2007, SPIE Advanced Lithography.

[20]  Oleg P. Kishkovich,et al.  Prevention of optics and resist contamination in 300-mm lithography: improvements in chemical air filtration , 2001, SPIE Advanced Lithography.

[21]  Hiroshi Ito,et al.  Influence of polymer properties on airborne chemical contamination of chemically amplified resists , 1993, Advanced Lithography.

[22]  Mark J. Camenzind,et al.  Analysis of organic contaminants from silicon wafer and disk surfaces by thermal desorption-GC-MS , 1999, Photonics West.

[23]  Andrew J. Dallas,et al.  Characterization and control of organic airborne contamination in lithographic processing , 2002, SPIE Advanced Lithography.