2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.