In-package wireless communication with TSV-based antenna
暂无分享,去创建一个
[1] Sujay Deb,et al. Millimeter-wave planar log periodic antenna for on-chip wireless interconnects , 2014, The 8th European Conference on Antennas and Propagation (EuCAP 2014).
[2] Baris Taskin,et al. Innovative propagation mechanism for inter-chip and intra-chip communication , 2015, 2015 IEEE 16th Annual Wireless and Microwave Technology Conference (WAMICON).
[3] M. Puech,et al. Fabrication of 3D packaging TSV using DRIE , 2008, 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
[4] Shahriar Mirabbasi,et al. Architecture and Design of Multichannel Millimeter-Wave Wireless NoC , 2014, IEEE Design & Test.
[5] C. Sharbono,et al. Factors affecting copper filling process within high aspect ratio deep vias for 3D chip stacking , 2006, 56th Electronic Components and Technology Conference 2006.
[6] Yu Su,et al. Communication Using Antennas Fabricated in Silicon Integrated Circuits , 2007, IEEE Journal of Solid-State Circuits.
[7] Chih-Ming Hung,et al. The feasibility of on-chip interconnection using antennas , 2005, ICCAD.
[8] A. Sugavanam,et al. On-chip antennas in silicon ICs and their application , 2005, IEEE Transactions on Electron Devices.
[9] Chita R. Das,et al. Design and evaluation of a hierarchical on-chip interconnect for next-generation CMPs , 2009, 2009 IEEE 15th International Symposium on High Performance Computer Architecture.
[10] K. Kim,et al. Integrated dipole antennas on silicon substrates for intra-chip communication , 1999, IEEE Antennas and Propagation Society International Symposium. 1999 Digest. Held in conjunction with: USNC/URSI National Radio Science Meeting (Cat. No.99CH37010).
[11] Junji Yamauchi,et al. Shortening ratios of modified dipole antennas , 1984 .