论文信息 - An Electromagnetically Coupled Package Feed-Through Structure for Multilayer Carrier Substrates

An Electromagnetically Coupled Package Feed-Through Structure for Multilayer Carrier Substrates

Theoretical and first scaled experimental results are presented for an electromagnetically coupled feed-through structure for multilayer carrier substrates. This structure combines an inherent DC isolation with an improved hermetic sealing, as no conductor - at least for the RF - needs to penetrate the top layer of the substrate. The design of this interconnect is done using a FDTD software.

W. Menzel | J. Kassner

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