On-State Current Degradation Owing to Displacement Defect by Terrestrial Cosmic Rays in Nanosheet FET

Silicon displacement defects are caused by various effects. For instance, epitaxial crystalline silicon growth and ion implantation often result in defects induced by the fabrication process, whereas displacement damage is induced by terrestrial cosmic radiation. Clustered displacement damage reportedly reduces the on-state current (Ion) in ordinary MOSFETs. In the case of an extremely scaled device such as a nanosheet field-effect transistor (NS-FET), the impact of displacement defect size was analyzed on the basis of the NS dimensions related to the device characteristics. In this study, we investigated the effect of displacement defects on NS-FETs using technology computer-aided design; the simulation model included quantum transport effects. The geometrical conditions, temperatures, trap concentrations, and scattering models were considered as the variables for on-state current reduction.

[1]  Jungsik Kim The Impact of Displacement Defect in Nanosheet Field Effect Transistor , 2020 .

[2]  M. Meyyappan,et al.  Caution: Abnormal Variability Due to Terrestrial Cosmic Rays in Scaled-Down FinFETs , 2019, IEEE Transactions on Electron Devices.

[3]  I. Berbezier,et al.  New strategies for producing defect free SiGe strained nanolayers , 2018, Scientific Reports.

[4]  M. Meyyappan,et al.  Reduction of Variability in Junctionless and Inversion-Mode FinFETs by Stringer Gate Structure , 2018, IEEE Transactions on Electron Devices.

[5]  D. Corliss,et al.  Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET , 2017, 2017 Symposium on VLSI Technology.

[6]  M. Meyyappan,et al.  Stringer Gate FinFET on Bulk Substrate , 2016, IEEE Transactions on Electron Devices.

[7]  Victor Moroz,et al.  Transistor design for 5nm and beyond: Slowing down electrons to speed up transistors , 2016, 2016 17th International Symposium on Quality Electronic Design (ISQED).

[8]  Phil Oldiges,et al.  Performance trade-offs in FinFET and gate-all-around device architectures for 7nm-node and beyond , 2015, 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

[9]  M. Luisier,et al.  FinFET to nanowire transition at 5nm design rules , 2015, 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

[10]  Victor Moroz,et al.  Extending drift-diffusion paradigm into the era of FinFETs and nanowires , 2015, 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

[11]  G. P. Ginet,et al.  AE9, AP9 and SPM: New Models for Specifying the Trapped Energetic Particle and Space Plasma Environment , 2013 .

[12]  Yuan Taur,et al.  Compact Modeling of Experimental n- and p-Channel FinFETs , 2010, IEEE Transactions on Electron Devices.

[13]  T. Poiroux,et al.  Full Quantum Treatment of Remote Coulomb Scattering in Silicon Nanowire FETs , 2009, IEEE Transactions on Electron Devices.

[14]  A. Larsen Epitaxial growth of Ge and SiGe on Si substrates , 2006 .

[15]  T. Parrill,et al.  On the FinFET extension implant energy , 2003 .

[16]  J. Johnson,et al.  Lateral ion implant straggle and mask proximity effect , 2003 .

[17]  Robert Burger,et al.  DoD Silicon Investment Strategy , 1992 .

[18]  D. Klaassen,et al.  A new recombination model for device simulation including tunneling , 1992 .

[19]  J. Ziegler,et al.  The effect of sea level cosmic rays on electronic devices , 1981, 1980 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.