Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
暂无分享,去创建一个
H. Reichl | Jin Yu | O. Ehrmann | G. Engelmann | M.J. Wolf | C. Jurenka | Jon Yeon Kim
[1] Rao Tummala,et al. Fundamentals of Microsystems Packaging , 2001 .
[2] C. Handwerker,et al. Calculation of Phase Equilibria in Candidate Solder Alloys , 2001, International Journal of Materials Research.
[3] W. T. Chen,et al. Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films , 2002 .