Design Optimization of a New Hot Heat Sink with a Rectangular Fin Array for Thermoelectric Dehumidifiers

The objective of this research was aimed at conducting an experimental investigation to study the heat sink performance of a new rectangular fins array. Various operating conditions were considered, namely the distance between the fan and the fins, varied from 0 mm to 40 mm, heat supplied to the sink and the fan voltage. It was concluded that a fan installed at 30 mm height from the fins is recommended as the hot side temperature was the lowest. Next a pre-experimentation of small scale prototype of thermoelectric Dehumidifier (TED) was designed and constructed. It was composed of two thermoelectric (TE) cooling modules, MT2-1, 6-127, (two in serial) mounted between the rectangular fin heat exchangers with dimension 140 × 240 × 35 mm. The hot side was cooled by a ventilation fan whereas the air flow on the cold side was free convection. The effect of position of fan was investigation experimentally. Preliminary tests confirmed the good performance of the hot heat sink design for the intended thermoelectric application.

[1]  Bin-Juine Huang,et al.  A design method of thermoelectric cooler , 2000 .

[2]  Y. Jaluria,et al.  An Introduction to Heat Transfer , 1950 .

[3]  R. Jaeger,et al.  Heat sink optimization with application to microchannels , 1992 .

[4]  Kadir Bilen,et al.  Heat transfer and thermal performance analysis of a surface with hollow rectangular fins , 2006 .

[5]  F. Gugliermetti,et al.  Optimum design of vertical rectangular fin arrays , 1999 .

[6]  D. Rowe CRC Handbook of Thermoelectrics , 1995 .

[7]  M. Sivrioglu,et al.  Parametric study of natural convection heat transfer from horizontal rectangular fin arrays , 2000 .

[8]  Ahmed A. Abdel-latif,et al.  Experimental study of heat transfer and fluid flow in longitudinal rectangular-fin array located in different orientations in fluid flow , 2004 .

[9]  H. Sofrata,et al.  Heat rejection alternatives for thermoelectric refrigerators , 1996 .

[10]  R. Viskanta,et al.  Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging , 2000 .

[11]  Avram Bar-Cohen,et al.  Design and analysis of heat sinks , 1995 .

[12]  Dae-Young Lee,et al.  Comparative analysis of jet impingement and microchannel cooling for high heat flux applications , 1999 .

[13]  Reiyu Chein,et al.  Performances of thermoelectric cooler integrated with microchannel heat sinks , 2005 .

[14]  S. Venkateshan,et al.  Experimental study of free convection and radiation in horizontal fin arrays , 1996 .

[15]  P. Lettieri,et al.  An introduction to heat transfer , 2007 .

[16]  J. Zemel,et al.  Analysis of microchannels for integrated cooling , 1992 .

[17]  Roy W. Knight,et al.  Optimal Thermal Design of Forced Convection Heat Sinks-Analytical , 1991 .

[18]  Miroslav Bojic Thermoelectric cooling of a train carriage by using a coldness-recovery device , 1997 .