Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites
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Hongchao Wu | Zhongying Ji | Yuxiong Guo | Chenliang Gong | Keda Li | Jinghong Ding | Wenwen Wang | Jiaqi Ji | Qi Pei | Xiaolong Wang