论文信息 - (Invited) Technologies and Challenges of Fine Pitch Backside Via-Last TSV Process Integration for 3DIC Applications - 字舞流文

(Invited) Technologies and Challenges of Fine Pitch Backside Via-Last TSV Process Integration for 3DIC Applications

P. C. Chang | Y. H. Chang | Y. C. Hsin | C. H. Lin | Y. M. Lin | S. C. Liao | P. J. Tzeng | T. C. Hsu | C. C. Chen | C. C. Wang | Tzukun Ku | E. H. Chen | S. C. Chen | J. C. Chen