Analysis of microchannel heat sink performance using nanofluids

Abstract In this study, silicon microchannel heat sink performance using nanofluids as coolants was analyzed. The nanofluid was a mixture of pure water and nanoscale Cu particles with various volume fractions. The heat transfer and friction coefficients required in the analysis were based on theoretical models and experimental correlations. In the theoretical model, nanofluid was treated as a single-phase fluid. In the experimental correlation, thermal dispersion due to particle random motion was included. The microchannel heat sink performances for two specific geometries, one with W ch  =  W fin  = 100 μm and L ch  = 300 μm, the other with W ch  =  W fin  = 57 μm and L ch  = 365 μm, were examined. Because of the increased thermal conductivity and thermal dispersion effects, it was found that the performances were greatly improved for these two specific geometries when nanofluids were used as the coolants. In addition to heat transfer enhancement, the existence of nanoparticles in the fluid did not produce extra pressure drop because of small particle size and low particle volume fraction.

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